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Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology

: Richter, M.D.; Becker, K.-F.; Bottcher, L.; Schneider, M.


Informationstechnische Gesellschaft -ITG-:
German Microwave Conference, GeMiC 2009. CD-ROM : March, 16 - 18, 2009, München
Berlin: VDE-Verlag, 2009 (ITG-Fachberichte 213)
ISBN: 978-3-8007-3150-3
Art. 4815915
German Microwave Conference (GeMIC) <2009, München>
Fraunhofer IZM ()

A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.