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Precision material deposition for SiP manufacturing using jetting processes

: Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.


IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-:
60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 2 : 1-4 June 2010, Las Vegas, NV, USA
New York, NY: IEEE, 2010
ISBN: 978-1-4244-6410-4
ISBN: 978-1-4244-6412-8
Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>
Fraunhofer IZM ()

During the last years, jetting processes for higher viscosity materials have gained widespread interest in microelectronics manufacturing. Main reasons for this interest are high throughput/productivity of jetting, contactless material deposition, high volume precision and freely designable deposition patterns. Especially the higher viscosity materials are of interest for the integration of a variety of heterogeneous components as needed for the assembly of System in Package. As knowledge on jetting behavior of these materials is not generally available, a study combining material analysis and process development has been conducted with the aim to demonstrate the limits of jet dispensing for higher viscosity materials. Summarized this paper gives a detailed insight into jet process develop for higher viscosity materials necessary for SiP assembly and describes process design rules and limitations and thus allows the optimized use of advanced jetting technology for micro electronics assembly.