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2010
Conference Paper
Titel
Reliability of through silicon via technologies
Abstract
A lot of technologies are suggested to build up 3-dimensional integrated systems. Due to the relatively short history of 3D-integration attempts most of these technologies are still far away of being mature modules. After a period of time with public relation for 3D-integration by presenting new technological results, now it is necessary to turn attention towards practicability and value for products. The key word is reliability.