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Reliability of through silicon via technologies

: Klumpp, A.; Ramm, P.


Flake, J. ; Electrochemical Society -ECS-, Dielectric Science and Technology Division:
Processing, Materials, and Integration of Damascene and 3D Interconnects : Papers originally presented in the Symposium "Processing, Materials and Integration of Damascene and 3D Interconnects", held during the 216th meeting of the Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009
Pennington, NJ: ECS, 2010 (ECS transactions Vol.25, Issue 38)
ISBN: 978-1-607-68162-5
ISBN: 978-1-56677-812-1
Symposium "Processing, Materials and Integration of Damascene and 3D Interconnects" <2009, Vienna>
Electrochemical Society (ECS Meeting) <216, 2009, Vienna>
Fraunhofer IZM ()

A lot of technologies are suggested to build up 3-dimensional integrated systems. Due to the relatively short history of 3D-integration attempts most of these technologies are still far away of being mature modules. After a period of time with public relation for 3D-integration by presenting new technological results, now it is necessary to turn attention towards practicability and value for products. The key word is reliability.