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Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique

: Dowha, .; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.


Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
Fraunhofer IZM ()

Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on micro-scale and nano-scale. The presented paper focuses on application of the nanoindentation technique in order to extract the basic elastic and elasto-plastic mechanical properties through numerical approaches. In order to extract the elasto-plastic material data of the investigated thin layers the numerical process was designed. First of all, the nanoindentation process was elaborated in FEM Abaqus software. Then, the results were compared to the measurements and processed by the numerical optimization algorithms.