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A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links

: Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.


Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
Fraunhofer IZM ()

For the first time we present a small form-factor, low-cost package that is suitable for transmitter optical subassemblies (TOSAs) and receiver optical subassemblies (ROSAs) with serial speeds up to 40 Gbit/s. The TOSA includes a very high speed vertical cavity surface emitting laser (VCSEL) and a driver integrated circuit (IC) inside the package and the ROSA combines a high speed photodiode (PD) with a transimpedance amplifier (TIA) IC. The overall housing concept is based on a TO-can (Transistor Outline) packaging technology in order to realize a hermetically-sealed, high volume and low cost prototype product solution. The radial dimensions of the TOSA/ROSA package are selected to fit easily within standard optical transceiver form-factors for example SFP and QSFP (quad small form-factor pluggable).