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Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods

: Dowha, L.; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.


Microelectronics reliability 51 (2011), Nr.6, S.1046-1053
ISSN: 0026-2714
Fraunhofer IZM ()

Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials in micro-scale and nano-scale. The presented paper focuses on an application of the nanoindentation technique to extract the basic elastic and elasto-plastic mechanical properties through numerical approaches. In order to extract the elasto-plastic material data of the investigated thin layers the numerical process was designed. Firstly, the nanoindentation process was prepared as finite-element model (FEM). Then, the results were compared to the measurements and processed by the numerical optimization algorithms.