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The center for non-destructive nano evaluation of electronic packaging (nanoEVA), a new research facility in dresden

 
: Heuer, H.; Köhler, B.; Krüger, P.; Meyendorf, N.; Oppermann, M.; Wolter, K.-J.

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Institute of Electrical and Electronics Engineers -IEEE-:
30th International Spring Seminar on Electronics Technology, ISSE 2007 : Cluj-Napoca, Romania, 9 - 13 May 2007
New York, NY: IEEE, 2007
ISBN: 1-4244-1217-X
ISBN: 978-1-4244-1217-4
ISBN: 1-4244-1218-8
S.273-277
International Spring Seminar on Electronics Technology (ISSE) <30, 2007, Cluj-Napoca, Romania>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
The challenge of nano packaging requires new non-destructive evaluation (NDE) techniques to detect and characterize very small defects like Kirkendall voids or micro cracks. Imaging technologie s with resolutions in the sub-micron range are desired. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy. However, techniques with this resolution can not be found on the market. The Center for Non-Destructive Nano Evaluation (nanoeva) is launched to develop this equipment jointly with the electronics industry and to transfer the knowledge to colleagues in industry and research institutions. The new center is a common organization of Fraunhofer IZFP-D and the Centre of Microtechnical Manufacturing (ZpP) of the Technische Universität Dresden.

: http://publica.fraunhofer.de/dokumente/N-172857.html