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Nano evaluation in electronics packaging

 
: Oppermann, M.; Heuer, H.; Meyendorf, N.; Wolter, K.-J.

:

Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.2 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 978-1-4244-2814-4
ISBN: 1-4244-2813-0
S.1029-1034
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
The challenge of nano packaging requires new nondestructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the submicron range are the desire. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy. However, techniques with this resolution can not be found on the market. The "Center for Non-Destructive Nano Evaluation of Electronic Packaging" (nanoeva®) is taken up to develop this equipment in cooperation with the electronics industry and to transfer the knowledge to colleagues in industries and research institutions. The new center is a common organization of Fraunhofer IZFP-D and the Electronics Packaging Lab with its Centre of Microtechnical Manufacturing (ZP) of the Technische Universität Dresden.

: http://publica.fraunhofer.de/dokumente/N-172850.html