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Nano packaging - A challenge for non-destructive testing

: Wolter, K.-J.; Oppermann, M.; Zerna, T.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
EPTC 2008, 10th Electronics Packaging Technology Conference : 9th-12th December 2008, Singapore
New York, NY: IEEE, 2008
ISBN: 978-1-4244-2117-6
ISBN: 978-1-4244-2118-3
Electronics Packaging Technology Conference (EPTC) <10, 2008, Singapore>
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

The challenge of nano packaging requires new nondestructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are the desire. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy. However, techniques with the necessary resolution can not be found on the market. The Center for Non-Destructive Nano Evaluation of Electronic Packaging (nanoeva®) is taken up to develop this equipment in cooperation with the electronics industry and to transfer the knowledge to colleagues in industries and research institutions. The new center is a common organization of Fraunhofer IZFP-D and the Electronics Packaging Lab with its Centre of Microtechnical Manufacturing (ZP) of the Technische Universität Dresden. This paper will focus on the new possibilities of nano x-ray CT and shows first results.