Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Temperature dependent fracture toughness of glass frit bonding layers

: Nötzold, K.; Dresbach, C.; Graf, J.; Böttge, B.


Courtois, B.:
Special issue on design, test, integration and packaging of MEMS/MOEMS 2009 : The Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) was held in Rome, Italy, 1 - 3 April 2009
Berlin: Springer, 2010 (Microsystem technologies 16.2010, Nr.7)
ISSN: 0946-7076
Symposium on Design, Test, Integration and Packaging of MEMS, MOEMS (DTIP) <2009, Rome>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IWM ()

Glass frit bonding is an important technology for the hermetical encapsulation of microsensors. During manifactiring processes and in application the bonding layer is repeatedly exposed to temperature changes. Therefore a meaningful stability assessment must consider possible temperature dependent fracture toughness parameters. This work shows that the influence of temperature changes on the fracture toughness depends on whether the bonding layer is subjected to externally pure tensile or combined tensile and shear loading. The reasons for this effect are discussed by use of finite element simulations. Two different kinds of cracks are compared with regard to the residual stresses that result from the wafer bonding process. These residual stresses have a high influence on the loading conditions at the crack tip, when the crack is kinking into the glass frit material. However, the influence of residual stresses on an interfacial crack that propagates parallel to the plan e of the bonding layer is almost negligible.