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Failure diagnostics for 3D system integration technologies in microelectronics

 
: Altmann, F.; Schmidt, C.; Brand, S.; Czurratis, P.; Petzold, M.

:

Colinge, C. ; Electrochemical Society -ECS-:
Semiconductor Wafer Bonding 11. Science, Technology, and Applications : In honor of Ulrich Gösele; Presented in the symposium entitled "Semiconductor Wafer Bonding 11: Science, Technology, and Applications - in Honor of Ulrich Gösele" held during the 218th meeting of the Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010
Pennington, NJ: ECS, 2010 (ECS transactions 33.2010, Nr.4)
ISBN: 978-1-566-77823-7
ISBN: 978-1-60768-173-1
ISSN: 1938-5862
S.47-57
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <11, 2010, Las Vegas/Nev.>
Electrochemical Society (Meeting) <218, 2010, Las Vegas/Nev.>
Englisch
Konferenzbeitrag
Fraunhofer IWM ()

Abstract
The reduced testability of 3D integrated microelectronic systems poses severe challenges to microstructure diagnostics, fault isolation and failure analysis techniques that are required to detect and analyze electrical opens, high resistive contacts and electrical shorts of the interconnects in the wafer-bonded interface. The potential of applying advanced Scanning Acoustic Microscopy and Lock in Thermography methods for defect localization as well as the application of combined laser and Focused Ion Beam techniques for target preparation and defect diagnostics is demonstrated. ©The Electrochemical Society.

: http://publica.fraunhofer.de/dokumente/N-172568.html