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Advances in the design and test of a novel open ended microwave oven

: Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris

Courtois, B. ; IEEE Components, Packaging, and Manufacturing Technology Society; Circuits Multi-Projets -CMP-, Grenoble:
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 : Seville, Spain, 5-7 May 2010; including the Conference on CAD, Design and Test and the Conference on Microfabrication, Integration and Packaging
Piscataway/NJ: IEEE, 2010
ISBN: 978-1-4244-6636-8
ISBN: 978-2-35500-011-9
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2010, Seville>
Fraunhofer IPA ()
electronic packaging; packaging; microwave; Aufbautechnik; Verbindungstechnik; curing; temperature measurement; Mikrowelle

An enhanced open ended waveguide cavity oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor is used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1 °C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indi cates an 98% degree of cure.