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How to reduce plasma damage in sputtering processes

 
: Ansmann, P.; Perry, D.; Jaeger, A.

Semiconductor international 23 (2000), Nr.6, S.203-207
ISSN: 0163-3767
Englisch
Zeitschriftenaufsatz
Fraunhofer IFT; 2000 dem IZM eingegliedert

Abstract
Using a Plasma Damage Monitoring (PDM) tool, the influence of plasma process parameters on plasma damage caused during the sputter etch step prior to second-level aluminum metallization was determined. As a result, it was possible to increase the yield of devices.

: http://publica.fraunhofer.de/dokumente/N-170646.html