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A new and simple concept for self-aligned hybrid integration in silicon on insulator (SOI)

 
: Mitze, T.; Schnarrenberger, M.; Zimmermann, L.; Bruns, J.; Fidorra, F.; Kreißl, J.; Janiak, K.; Heidrich, H.; Petermann, K.

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1st IEEE International Conference on Group IV Photonics : Hong Kong, 29 September - 01 October 2004
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8474-1
S.162-164
IEEE International Conference on Group IV Photonics <1, 2004, Hong Kong>
Englisch
Konferenzbeitrag
Fraunhofer HHI ()

Abstract
A concept for a SOI motherboard is introduced. AuSn solder technology is used for hybrid integration. The device adjustment on the board is realised by passive self-alignment. First results on fabricated boards are very encouraging.

: http://publica.fraunhofer.de/dokumente/N-169682.html