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Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications

 
: Jiang, C.; Krozer, V.; Johansen, T.K.; Bach, H-G.; Mekonnen, G-G.; Zhang, R.; Pech, D.

:

Asia-Pacific Microwave Conference, APMC 2008 : 16 - 20 Dec. 2008, Hong Kong and Macau
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2641-6 (online)
Art. 4958062
Asia Pacific Microwave Conference (APMC) <20, 2008, Macau>
Englisch
Konferenzbeitrag
Fraunhofer HHI ()
electronics packaging; lead bonding; photodetector; random-access storage

Abstract
In this paper, we propose an accurate full 3D EM behavioral model of PD chips for the first time. The model, which is meshed at 130 GHz, runs for about 17 minutes on an Intel Core2 Duo CPU@3 GHz PC with 3.5 GB of RAM. The impact of various parameters in wire- bonding transitions for transmission characteristic is summarized in the Table I. When numbers of bonding wires are placed separately all through strips of CBCPWs as well as keeping an optimized gap of transitions, more than 10 GHz bandwidth improvement can be achieved compared the worst case. We also notice that optimization on bonding wires does not significantly improve the fast decay beyond 60 GHz. Further investigation and optimization of the transition is required including a redesign of the CBCPW.

: http://publica.fraunhofer.de/dokumente/N-169603.html