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The BOOM project: A new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards

: Stampoulidis, L.; Vyrsokinos, K.; Stamatiadis, C.; Avramopoulos, H.; Zimmermann, L.; Voigt, K.; Sheng, Z.; Thourhout, D. van; Kreissl, J.; Mörl, L.; Bolten, J.; Wahlbrink, T.; Gomez-Agis, F.; Tangdiongga, E.; Dorren, H.J.S.; Pagano, A.; Riccardi, E.


Righini, G.C. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Silicon photonics and photonic integrated circuits II : 12 - 16 April 2010, Brussels, Belgium
Bellingham, WA: SPIE, 2010 (Proceedings of SPIE 7719)
ISBN: 978-0-8194-8192-4
Paper 771909
Conference "Silicon Photonics and Photonic Integrated Circuits" <2, 2010, Brussels>
Fraunhofer HHI ()

The European BOOM project aims at the realization of high-capacity photonic routers using the silicon material as the base for functional and cost-effective integration. Here we present the design, fabrication and testing of the first BOOMgeneration of hybrid integrated silicon photonic devices that implement key photonic routing functionalities. Ultra-fast all-optical wavelength converters and micro-ring resonator UDWDM label photodetectors are realized using either 4um SOI rib or SOI nanowire boards. For the realization of these devices, flip-chip compatible non-linear SOAs and evanescent PIN detectors have been designed and fabricated. These active components are integrated on the SOI boards using high precision flip-chip mounting and heterogeneous InP-to-silicon integration techniques. This type of scalable and cost-effective silicon-based component fabrication opens up the possibility for the realization of chip-scale, power efficient, Tb/s capacity photonic routers.