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Flip chip molding - highly reliable flip chip encapsulation

 
: Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.

:

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Components, Assemblies, and Materials Association:
52nd Electronic Components & Technology Conference 2002. Proceedings : San Diego, California, USA, May 28 - 31, 2002
Piscataway, NJ: IEEE Order Department, 2002
ISBN: 0-7803-7430-4
ISBN: 0-7803-7431-2
S.717-725
Electronic Components and Technology Conference (ECTC) <52, 2002, San Diego/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()
flip chip molding; flip chip encapsulation; interconnect length; simultaneous interconnection; process time; reliability; transfer molding; underfilling; overmolding; encapsulation; CTE; thermal mismatch; BGA; CSP; inhomogeneous topography

Abstract
Flip chip technology has the shortest interconnect length for minimum signal disturbance and simultaneous interconnection leading to reduced process times especially for high I/O counts and for RF applications. Flip chip technology allows for reliabilities required for automotive applications, but to achieve this goal, a plastic encapsulant, the so called underfiller, has to be used. New material developments for transfer molding allow underfilling and overmolding in one single transfer molding step. Existing standard equipment for encapsulation can be used and no additional process step for underfill dispensing is required. Molded flip chips have the potential of high reliability as the low CTE of the flip chip molding compound reduces the thermal mismatch. State of the art in FC molding is the encapsulation of single chip packages as BGA or CSP. Trends of the market drive towards SIPs with an integration of different devices as e.g. SMD and FC. Therefore the highly reliable encapsulation of these hybrid packages with inhomogeneous topography is the future goal. For the qualification of flip chip molding a test vehicle has been designed at Fraunhofer IZM. This test vehicle for process evaluation allows the encapsulation and underfilling of a single flip chip.

: http://publica.fraunhofer.de/dokumente/N-16837.html