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Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

 
: Zimmermann, L.; Preve, G.B.; Tekin, T.; Rosin, T.; Landles, K.

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IEEE Journal of Selected Topics in Quantum Electronics 17 (2011), Nr.3, S.645-651
ISSN: 1077-260X
Englisch
Zeitschriftenaufsatz
Fraunhofer HHI ()
Fraunhofer IZM ()

Abstract
We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices.

: http://publica.fraunhofer.de/dokumente/N-168020.html