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Power efficient data communication modules for optical networks

: Schröder, H.; Brusberg, L.; Stobbe, L.; Tekin, T.


Thienpont, H. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Micro-Optics 2010 : 12.-16.4.2010, Brussels, Belgium
Bellingham, WA: SPIE, 2010 (Proceedings of SPIE 7716)
ISBN: 978-0-8194-8189-4
Paper 771629
Conferecne "Micro-Optics" <2010, Brussels>
Fraunhofer IZM ()

Optical interconnect technology is discussed as a way to more power efficient tele- and data-communication systems. That is well confirmed for long reach optical interconnects but can be gained also from inter and intra system optical interconnects. Besides component and system architecture issues it is assumed that advanced photonic packaging approaches cause power efficiency advantages at multi chip module level. Transparent thin glass substrates are used for high frequency electrical interconnects and integrated optical waveguides for chip to chip optical communication. A generic approach called glassPack is discussed and some relevant technologies are presented in more detail.