Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Packaging and assembly for integrated photonics - the ePIXpack photonics packaging service

 
: Zimmermann, L.; Preve, G.B.; Tekin, T.; Rosin, T.

:

IEEE Photonics Society:
23rd Annual Meeting of the IEEE Photonics Society 2010 : 7-11 Nov. 2010, Denver, CO, USA
New York, NY: IEEE, 2010
ISBN: 978-1-4244-5368-9
ISBN: 978-1-4244-5369-6
S.167-168
IEEE Photonics Society (Annual Meeting) <23, 2010, Denver/Colo.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
The photonics packaging platform ePIXpack serves the academic community with packaging & assembly developments in the area of integrated photonics. Here we shall review the concept of ePIXpack and some of their recent work.

: http://publica.fraunhofer.de/dokumente/N-168014.html