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Strength and long-term reliability testing of wafer-bonded MEMS

: Petzold, M.; Katzer, D.; Wiemer, M.; Bagdahn, J.


Courtois, B. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 : 6 - 8 May 2002, Cannes, France
Bellingham/Wash.: SPIE, 2002 (SPIE Proceedings Series 4755)
ISBN: 0-8194-4518-5
Design, Test, Integration, and Packaging of MEMS/MOEMS <2002, Cannes>
Fraunhofer IWM ()
wafer-bonded MEMS; strength; long-term reliability testing; MEMS; MOEMS; fabrication; strength testing; tensile testing; double-cantilever beam testing; wafer-bonded component; interfacial atomic bonding strength; interface void; notch; chemical etching; physical etching; bonding; fracture limit; micro chevron test; wafer bonding process; quality control; MEMS fabrication; lifetime; fatigue; wafer-bonded sample; constant stress; cyclic stress; Si

Wafer bonding techniques are frequently used for MEMS/MOEMS fabrication. In this paper, the potential application and methodical limitations of different strength testing approaches including tensile testing and double-cantilever-beam testing for wafer-bonded components are investigated. Special attention is given to the influence of the interfacial atomic bonding strength, the role of interface voids and notches caused by chemical or physical etching steps prior to bonding on the fracture limit. A particular aim of the paper is to discuss the potential of the Micro Chevron-Test for the assessment of the wafer bonding process with particular respect to the quality control during MEMS fabrication. In addition, the methods can also be applied to investigate the lifetime and fatigue properties of wafer-bonded samples exposed to constant or cyclic stresses.