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Investigations regarding through silicon via filling for 3D integration by periodic pulse reverse plating with and without additives

: Hofmann, L.; Ecke, R.; Schulz, S.E.; Geßner, T.


Travaly, Y.:
International Workshop on "Materials for Advanced Metallization", MAM 2010 : Mechelen (Malines), Belgium, was held from March 7th to March 10th
Amsterdam: Elsevier, 2011 (Microelectronic engineering 88.2011, Nr.5)
ISSN: 0167-9317
International Workshop on Materials for Advanced Metallization (MAM) <19, 2010, Mechelen/Belgium>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer ENAS ()

In this contribution we show experimental investigations regarding Periodic Pulse Reverse (PPR) plating for the filling of Through Silicon Vias that are aimed for the use in 3D integration applications. The purpose of this method is to prevent the use of plating additives that induce high process complexity in terms of process control and high process costs due to the high consumption of those additives. We therefore compare the effect of PPR plating without additives to that effect of PPR plating with additives. In first results with non-optimized PPR plating we already show the large gain in step coverage during TSV filling compared to standard DC plating.