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Assembly of Ultra Thin and Flexible ICs

: Adler, C.; Klink, G.; Feil, M.; Ansorge, F.; Reichl, H.


Kivilahti, J.; Hyytiaeinen, M. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Adhesives in Electronics 2000. 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing : Espoo, Finland, June 18 - 21, 2000
New York, NY: IEEE, 2000
ISBN: 0-7803-6460-0
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing <4, 2000, Helsinki>
Fraunhofer IZM ()
Ultra thin silicon; flexible IC; mounting; packaging; isoplanar contact

The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 5m. These very thin ICs offer several advantages like low package height, flexibility and low topography for interconnection. These properties make them an ideal candidate for their integration in flexible substrates like polymer foil or even paper. Possible applications for such systems are electronic labels, tickets or security papers. For these systems different die bonding and electrical interconnection methods can be used. The paper describes new fundamentals for interconnection of ultra thin ICs and systems to flexible substrates.