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Process Evaluation of Advanced Thick Film Techniques for RF-Applications

 
: Klink, G.; Richter, H.; Feil, M.

Mach, P.; Urbanek, J.:
European Microelectronics Packaging and Interconnection Symposium 2000. Proceedings
Prag: IMAPS, Czech and Slovak Chapter, 2000
ISBN: 80-238-5509-3
S.175-181
European Microelectronics Packaging and Interconnection Symposium <2000, Prag>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()
advanced thick film; microwave circuits; process technology; etchable conductor paste

Abstract
For fabrication of RF-circuits different suppliers offer new thick-film materials with line resolutions formerly reserved to thin film technology. One of these materials the gold paste KQ 500 (Heraeus) has been investigated in this work. In order to assure efficiency of the paste test boards with vias and test elements were fabricated. Line resolution, thickness uniformity, via contacts, conductivity and adhesion are evaluated. Finally performance and cost aspects are discussed in comparison to thin film.

: http://publica.fraunhofer.de/dokumente/N-1600.html