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Investigations on interconnection technologies for CPV systems

: Wiesenfarth, M.; Thaller, S.; Jaus, J.; Eltermann, F.; Passig, M.; Bett, A.W.

Volltext urn:nbn:de:0011-n-1592612 (596 KByte PDF)
MD5 Fingerprint: f3ff58c833655f8628d875924b73d39d
Erstellt am: 8.8.2014

European Commission:
25th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2010. Proceedings : 5th World Conference on Photovoltaic Energy Conversion, 6-10 , September 2010, Valencia, Spain
München: WIP-Renewable Energies, 2010
ISBN: 3-936338-26-4
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <25, 2010, Valencia>
World Conference on Photovoltaic Energy Conversion <5, 2010, Valencia>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Konzentratormodule; Konzentrator-Produktionsprozess; Konzentrator-Zuverlässigkeitsuntersuchung; Materialien - Solarzellen und Technologie; III-V und Konzentrator-Photovoltaik; Alternative Photovoltaik-Technologien; Konzentrator-Bauelemente; Hochkonzentrierende Systeme (HCPV); Konzentratormodule; Konzentrator-Produktionsprozess; Konzentrator-Zuverlässigkeitsuntersuchung

Long lifetime of concentrator photovoltaic systems strongly depends on the reliability of the interconnection technologies. In this paper the result of experiments to investigate the long term stability of a lead free Sn95.5Ag4Cu0.5 solder alloy and two isotropic conductive adhesives are presented. Samples were subjected to accelerated aging consisting of high temperature storage at 150 °C and temperature cycles between -30 and 125 °C. The samples were characterised after various aging steps by x-ray imaging, scanning electron microscope and energy dispersive x-ray. The experiments showed a degradation of the soldered samples through the formation of cracks in the joint. Also a growth of brittle intermetallic phases was determined which can promote the generation of cracks. One of the tested adhesives shows a positive post curing and no degradation after aging. The second adhesive shows some cracks after the hard tests.