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Fast and precise resistance characterisation of laser drilled and metallized vias

: Menkoe, M.; Reitenbach, H.; Hoenig, R.; Clement, F.; Biro, D.; Preu, R.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society:
35th IEEE Photovoltaic Specialists Conference, PVSC 2010. Vol.2 : Honolulu, Hawaii, USA, 20 - 25 June 2010
Piscataway/NJ: IEEE, 2010
ISBN: 978-1-4244-5890-5
ISBN: 978-1-4244-5891-2
ISBN: 978-1-4244-5892-9
Photovoltaic Specialists Conference (PVSC) <35, 2010, Honolulu/Hawaii>
Fraunhofer ISE ()

Concerning cell concepts using metallized vias for the interconnection between the front- and the rear side in general, for example the MWT (Metal Wrap Through) concept, via resistance losses have a high impact on cell performance. Hence, establishing a fast, precise and reliable characterization instrument allowing a faster development of metallization pastes and hole drilling processes is the purpose of this work.