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2010
Conference Paper
Titel
Fast and precise resistance characterisation of laser drilled and metallized vias
Abstract
Concerning cell concepts using metallized vias for the interconnection between the front- and the rear side in general, for example the MWT (Metal Wrap Through) concept, via resistance losses have a high impact on cell performance. Hence, establishing a fast, precise and reliable characterization instrument allowing a faster development of metallization pastes and hole drilling processes is the purpose of this work.