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Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers

 
: Wächtler, T.; Oswald, S.; Pohlers, A.; Schulze, S.; Schulz, S.E.; Gessner, T.

McKerrow, A.J. ; Materials Research Society -MRS-:
Advanced Metallization Conference, AMC 2007 : Proceedings of the conference held October 9 - 11, 2007, in Albany, New York and October 22 - 24, 2007, at the University of Tokyo, Tokyo, Japan
Warrendale, Pa.: MRS, 2008
ISBN: 978-1-558-99992-3
S.23-29
Advanced Metallization Conference (AMC) <24, 2007, Albany/NY; Tokyo>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-156359.html