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Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
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2008
Conference Paper
Titel
Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
Author(s)
Wächtler, T.
Oswald, S.
Pohlers, A.
Schulze, S.
Schulz, S.E.
Gessner, T.
Hauptwerk
Advanced Metallization Conference, AMC 2007
Konferenz
Advanced Metallization Conference (AMC) 2007
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM