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Development and characterization of Cu to Cu bonding technology

 
: Baum, M.; Letsch, H.; Shaporin, A.V.; Otto, T.; Gessner, T.

Gessner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart systems integration 2007 : Paris, France 27. - 28.03.2007; With CD-ROM / 1st European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2007
ISBN: 3-8007-3009-X
ISBN: 978-3-8007-3009-4
S.427-429
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <1, 2007, Paris>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-154614.html