English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Impact of dielectric material and metal arrangement on thermal behaviour of interconnect systems
Details
Full
Export
Statistics
Options
2007
Conference Paper
Titel
Impact of dielectric material and metal arrangement on thermal behaviour of interconnect systems
Author(s)
Schulze, K.
Schulz, S.E.
Gessner, T.
Hauptwerk
Advanced Metallization Conference, AMC 2006
Konferenz
Advanced Metallization Conference (AMC) 2006
Language
English
google-scholar
View Details
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM