Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Trends in 3D Integration of MEMS and Electronics
| Knechtel, R.:
WaferBond 2009, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration : 6th - 8th December 2009, Grenoble, France ; [WaferBond '09]
Grenoble, 2009
S.107-110 |
| Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration <2009, Grenoble> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer ENAS () |