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Thermo mechanical characterization of packaging polymers

 
: Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J.

International Microelectronics and Packaging Society -IMAPS-, Italian Chapter; Institute of Electrical and Electronics Engineers -IEEE-:
EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM : June 15th-18th, 2009 , Rimini, Italy
New York, NY: IEEE, 2009
ISBN: 0-615-29868-0
ISBN: 978-0-615-29868-9
ISBN: 978-1-4244-4722-0
S.713-722
European Microelectronics and Packaging Conference and Exhibition (EMPC) <17, 2009, Rimini>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand the cure reaction and to establish the cure kinetics model. In the dasiameasurementpsila step, two different sets of equipment were applied. The elongation modulus is determined by dynamic mechanical analysis (equipment: DMA dasiaQ800psila) in a wide range of temperatures and frequencies. The other parameters are measured by pressure-volume-temperature experiments (equipment: PVT dasiaGnomixpsila). Conducting these characterization tests, the bulk modulus (K), the coefficient of thermal expansion (CTE), and the cure shrinkage was determined. The paper describes this comprehensive characterization with the measurement setups and parameter selection. E(T,t), K(T,t), CTE(T), Tg and cure shrinkage are determined to define a complete and consistent material model. Subsequently, the characterization results are presented, discussed and further work of implementing the complete material model into FEM simulation tools like Ansystrade is outlined.

: http://publica.fraunhofer.de/dokumente/N-154127.html