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Characterization of eutectic wafer bonding using gold and silicon

: Lin, Y.; Baum, M.; Haubold, M.; Frömel, J.; Wiemer, M.; Gessner, T.; Esashi, M.

Gessner, T.:
Smart systems integration 2009. CD-ROM : Brussels, Belgium, 10 - 11 March 2009
Berlin: Akademische Verlagsgesellschaft Aka, 2009
ISBN: 978-3-89838-616-6
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <3, 2009, Brussels>
Fraunhofer ENAS ()

In this paper, the investigation of eutectic bonding at wafer level was implemented using single crystalline Si, poly-Si and a-Si. Manifold experiment parameters of material and process were employed. Strength and yield of the bonds were investigated and characterized. Typical optical methods like SEM, infrared as well as ultra sonic measurements were performed to observe visual features. These results show the possibilities of this technology and open future practical application.