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A novel method for the fabrication of deep-submicron structure

: Jia, C.; Wiemer, M.; Grunert, J.; Otto, T.; Gessner, T.

Gessner, T.:
Smart systems integration 2009. CD-ROM : Brussels, Belgium, 10 - 11 March 2009
Berlin: Akademische Verlagsgesellschaft Aka, 2009
ISBN: 978-3-89838-616-6
4 S.
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <3, 2009, Brussels>
Fraunhofer ENAS ()

In this study, the authors will explore the minimum geometric dimensions that can be realized by this lateral deposition method. Two technology routes are proposed and verified. In section 2, they will illustrate experiment setup and fabrication results, section 3 shows some typical technological problems and their solutions. A discussion of possible applications of this method is presented in section 4. Finally, they will summarize the major conclusions of this work in the last section. Two lithography based methods that can produce regular submicron structures in large array are demonstrated. Different materials, such as PE-oxide, Fluorocarbon and sputtered metals, are tested to find their applicability in submicron fabrication. Densely-packed metal tubes of 130 nm wall thickness and height-to-thickness aspect ratio of more than 8 have been successfully fabricated. Through parallel arrangement of exposure reticule, submicron structure array that occupies an area of several tens of square millimeters can be produced. This method may be a practical method for the fabrication of photonic crystals.