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Laser processing of siliceous materials

 
: Panzner, M.; Lenk, A.; Wiedemann, G.; Hauptmann, J.; Weiss, H.-J.; Rümenapp, T.; Morgenthal, L.; Beyer, E.

Phipps, C.R. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
High-power laser ablation III
Bellingham, Wash.: SPIE, 2000 (SPIE Proceedings Series 4065)
ISBN: 0-8194-3700-X
S.621-634
International Conference on High Power Laser Ablation <3, 2000, Santa Fe/Mex.>
Englisch
Konferenzbeitrag
Fraunhofer IWS ()

Abstract
Laser processing of siliceous materials becomes increasingly important. Analogous to the laser processing of conventional materials there are applications in the fields of cleaning, surface processing, cutting etc. The present paper concerns the stat of the art and new applications: (1) Laser cleaning of natural stone surfaces. The good disability allows restoration work to be carried out conveniently, as for example the complete removal of crusts or the removal to such degree that moisture is not trapped beneath. (2) Non-slip finish of polished natural stone surfaces: The excellent focusing of laser beams on spots as small as 100 µm and below can be exploited to produce macroscopically invisible structures on the surfaces of different materials. This permits microscopically small craters and lentil shaped depressions to be generated on the stone surface. Therefore it is possible to provide a non-slip finish to polished natural stone surfaces without noticeably impairing the gloss. (3) Concrete cutting: In Europe, and particularly in Germany, there is a growing demand for redevelopment of concrete apartment buildings, involving the removal of non-bearing walls and the cutting of openings. The temporal relocation of residents due to the noise and moisture from the use of diamond tools could be avoided by applying a laser cutting technology. With a 3 kW-Nd-YAG-laser, 70 mm concrete can be cut with rates up to 25 mm/min.

: http://publica.fraunhofer.de/dokumente/N-14966.html