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Processing of silicon by Nd:YAG-lasers with harmonics generation

 
: Panzner, M.; Kaspar, J.; Wust, H.; Klotzbach, U.; Beyer, E.

:

Sugioka, K. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Photon Processing in Microelectronics and Photonics : 21 - 24 January 2002, San Jose, USA
Bellingham/Wash.: SPIE, 2002 (SPIE Proceedings Series 4637)
ISBN: 0-8194-4376-X
S.496-504
Conference "Photon Processing in Microelectronics and Photonics" <2002, San Jose/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IWS ()
silicon processing; diode pumped q-switched Nd:YAG laser; thermal effect; molten material deposition; heat effected edge zone; harmonic generation; silicon microstructure; etched silicon structure; short pulse laser process; laser wavelength; process time; laser cutting; laser drilling; deep structure; ablation plasma heating; plasma temperature; silicon wall; plasma absorption; laser pulse duration; heat affected depth; melting; heat flow; plasma heating intensity; laser machining; laser parameter

Abstract
Micro structures in silicon are applied in different fields of industry, medicine and research. Examples are micro mechanical sensors for car security systems, nozzle plates for printer, and optical elements for X-ray beam splitting. Wherever the accuracy of etched silicon structures is not required, laser processes with short pulses and small wave length can be an option with the advantage of shorter process time. High quality cutting and drilling of silicon can be achieved by application of diode pumped q-switched Nd:YAG-lasers and harmonics generation. The short pulses (15 ns) and the UV wave length (355 nm) of the Gator UV from Lambda Physik AG, for example, allow a reduction of thermal effects like deposition of molten material and heat effected zones at the edges. Especially in the case of deep structures the ablation plasma causes powerful heating of the walls. An reduction of the plasma temperatures and so the heat influence on the walls can be realized by a small laser wave length with low plasma absorption. Short laser pulse durations are necessary to reduce the heat effected depth or melting due to heat flow from the ablation area into the bulk material. Also the duration and intensity of plasma heating is reduced by short laser pulses. In this contribution the possibilities and limits of laser machining of Si by diode pumped Nd:YAG-lasers with harmonics generation will be presented by means of structures processed by application of a scanner with f-theta-optic. The results will be discussed concerning the experimental setup and the laser parameters.

: http://publica.fraunhofer.de/dokumente/N-14965.html