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3D integration of image sensor SiP using TSV silicon interposer

: Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.


EPTC 2009, 11th Electronics Packaging Technology Conference : 9th-11th December 2009, Singapore
New York, NY: IEEE, 2009
ISBN: 978-1-4244-5099-2
ISBN: 978-1-4244-5100-5
Electronics Packaging Technology Conference (EPTC) <11, 2009, Singapore>
Fraunhofer IZM ()
automotive electronics; flip-chip devices; three-dimensional integrated circuits

3D system integration is a fast growing field that encompasses different types of technologies. The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component availability (wafer vs. bare die) and testability. The paper discusses a specific 3D image sensor system for automotive applications. The system is based on wafer level technology using silicon interposer with through silicon vias (TSV's), a flip chip assembled sensor element and a microcontroller. The specific system concept, the technical solution and results are discussed.