Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
| 21st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2010 : Held in Montecassino Abbey and Gaeta, Italy, from 11th until 15th October 2010
Amsterdam: Elsevier, 2010 (Microelectronics reliability 50.2010, Nr.9-11)
ISSN: 0026-2714
S.1454-1458 |
| European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <21, 2010, Gaeta/Italy> |
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| Englisch |
| Konferenzbeitrag, Zeitschriftenaufsatz |
| Fraunhofer IWM () |
Abstract
Microscopic Lock-In Thermography (LIT) has proven unsurpassed capability for non-destructive localization of thermally active defects like shorts or resistive opens, even through the full package. This paper briefly reviews the real-time pixel-wise lock-in methodology, as the key to the extreme temperature sensitivity. A typical LIT work-now is demonstrated whereby the main focus of the paper is to discuss and demonstrate different ways how to activate the thermally active defects with more complex DUTs/defect signatures, requiring ATE docking.