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Integration of multi physics modeling of 3D stacks into modern 3D data structures

: Schneider, P.; Heinig, A.; Fischbach, R.; Lienig, J.; Reitz, S.; Stolle, J.; Wilde, A.

Postprint urn:nbn:de:0011-n-1459873 (2.5 MByte PDF)
MD5 Fingerprint: 3668f0d90ceec75d8c1e8a3ad6216dde
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Erstellt am: 23.6.2012

Institute of Electrical and Electronics Engineers -IEEE-:
2nd IEEE International 3D System Integration Conference, 3DIC 2010 : Held at the "Fraunhofer Haus" in Munich in November 16-18, 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4577-0526-7
ISBN: 1-4577-0526-5
ISBN: 978-1-4577-0527-4
6 S.
International 3D System Integration Conference (3DIC) <2, 2010, Munich>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
3D IC; 3D data structures; multi physics modeling; Floorplanning; Place&Route

This paper deals with the concept of how to integrate results of multi physics investigation of 3D stacks into modern comprehensive 3D data structures. Beside a description of modern 3D data structures and methods for floorplanning and Place&Route, approaches for multi physics modeling are introduced. The extension of the layout optimization process by multi physics modeling is investigated. Finally, we conclude with a summary of the future needs for an improved interoperability.