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New electrical connection technology for microsystems using inktelligent printing® and functional nanoscaled INKS

 
: Sturm, H.; Sosna, C.; Buchner, R.; Werner, C.; Godlinski, D.; Zollmer, V.; Busse, M.; Lang, W.

:
Volltext urn:nbn:de:0011-n-1451497 (1.5 MByte PDF)
MD5 Fingerprint: 0fa49c00c05025b6270eae16b9b03c68
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Erstellt am: 12.11.2010


IEEE Electron Devices Society:
TRANSDUCERS 2009 : International Solid-State Sensors, Actuators and Microsystems Conference; 21 - 25 June 2009, Denver
Piscataway, NJ: IEEE, 2009
ISBN: 978-1-4244-4193-8 (online)
ISBN: 978-1-4244-4190-7 (print)
S.1702-1705
International Conference on Solid-State Sensors, Actuators, and Microsystems <15, 2009, Denver>
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IFAM ()

Abstract
A new electrical connection technology for highly miniaturized systems based on functional printing has been studied. INKtelligent printingreg with its ability to print structures in micrometer size uses electrically conductive inks with functional nanoparticles to provide MEMS devices with electrical contacts. Due to large dimensions of conventional packaging technologies like flip chip or wire bonding, INKtelligent printingreg will dramatically increase size of assembled systems. Here, an aerosol beam technology - also known as Maskless Mesoscale Material Deposition (M3Dreg) or Aerosol Jetreg - is presented. Tests have been done to characterize conductivity, contact resistance, long term stability and temperature dependency as also applications with flow sensors.

: http://publica.fraunhofer.de/dokumente/N-145149.html