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Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
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2010
Conference Paper
Titel
Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Author(s)
Kallmayer, C.
Walter, H.
Aschenbrenner, R.
Michel, B.
Hauptwerk
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM
Konferenz
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2010
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM