English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications
Details
Full
Export
Statistics
Options
2006
Conference Paper
Titel
Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications
Author(s)
Dreßler, M.
Rohde, H.
Liebing, G.
Becker, K.-F.
Wunderle, B.
Reichl, H.
Hauptwerk
Molded interconnect devices. 7. international congress 2006
Konferenz
International Congress Molded Interconnect Devices (MID) 2006
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM