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Characterization of thermal interface materials to support thermal simulation

: Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H.

Tima-Cmp Laboratory; Institute of Electrical and Electronics Engineers -IEEE-; Components, Packaging and Manufacturing Technology Society -CPMT-:
Collection of papers presented at the 12th International Workshop on Thermal Investigation of ICs and Systems 2006 : Nice, Côte d'Azur, France, 27 - 29 September 2006
Grenoble: TIMA Laboratory, 2006
ISBN: 2-916187-04-9
International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) <12, 2006, Nice>
Fraunhofer IZM ()

In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data. For the determination of this data an experimental set-up for a static measurement is presented, which evaluates thermal conductivity and interface resistance of thermal interface materials (e.g. adhesive, solder, pads, or pastes). A qualitative structure-property correlation is proposed taking into account particle size, filler content and void formation at the interface based on high resolution FIB imaging. The paper gives an overview over the set-up and the measurement technique and discusses experimental and simulation results.