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Wafer Bonding in Micro Mechanics and Microelectronics

An overview
 
: Wiemer, M.; Froemel, J.; Gessner, T.; Otto, T.

Michel, B.; Aschenbrenner, R.:
The world of electronic packaging and system integration : Anniversary edition 60th birthday of Herbert Reichl
Dresden: ddp Goldenbogen, 2004
ISBN: 3-932434-76-5
ISBN: 978-3-932434-76-1
S.307-313
Englisch
Aufsatz in Buch
Fraunhofer IZM ()
Fraunhofer ENAS ()

Abstract
The development of electronic and micro-mechanical components has been characterised by a constant increase in the level of integration and the packaging density. Key technologies in the production of electronic components and of wafer-based micro-systems are wafer bonding techniques like anodic bonding, silicon direct bonding, eutectic bonding and seal glass bonding. These technologies are used to assemble prefabricated micro mechanical components like inertial sensors and to fabricate starting materials for electronic components like SOI substrates. The paper gives an overview about the different bonding techniques and their fields of application.

: http://publica.fraunhofer.de/dokumente/N-140705.html