Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

From packaging to system integration – the paradigm shift in microelectronics

: Wolf, M.J.; Reichl, H.; Adams, J.; Aschenbrenner, R.

Michel, B.; Aschenbrenner, R.:
The world of electronic packaging and system integration : Anniversary edition 60th birthday of Herbert Reichl
Dresden: ddp Goldenbogen, 2004
ISBN: 3-932434-76-5
ISBN: 978-3-932434-76-1
Aufsatz in Buch
Fraunhofer IZM ()

Faced with the rapid development of IC technology the traditional packaging is merging into a complex system integration technique to satisfy the growing demand in terms of increased functionality, performance and miniaturization of electronic products. This requires the development of new packaging and system integration technologies using complex design tools along with new materials to realize complex systems in a package carrying multiple components such as silicon ICs, MEMS, sensors or optical devices. Some major aspects, challenges and requirements of system integration technologies are discussed which will be of special interest in the next years.