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Verfahren und Vorrichtung zur Beschichtung von Gegenstaenden mittels eines Niederdruckplasmas

Coating organic substrates that is made of metal, glass, plastics and ceramics, comprises activating vapor from coating material present in the form of precursor in activation zone and guiding the vapor in the direction of the substrate
 
: Jung, T.

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Frontpage ()

DE 102008064134 A: 20081219
DE 102008064134 A: 20081219
C23C0016
Deutsch
Patent, Elektronische Publikation
Fraunhofer IST ()

Abstract
(A1) Die vorliegende Erfindung betrifft ein neuartiges Verfahren zur Beschichtung von Substraten, bei dem der Dampf eines in Form eines Precursors vorliegenden Beschichtungsmaterials in einer Aktivierungszone aktiviert und in Richtung auf das Substrat gefuehrt wird, und die Aktivierung durch ein mittels Glimmentladung erzeugtes Plasma erfolgt, wobei zwischen dem erzeugten Plasma, das eine Plasmazone bildet, und der Aktivierungszone mindestens eine Dissipationszone zur Herabsetzung der Energie des Plasmas angeordnet ist.

 

WO 2010069594 A1 UPAB: 20100714 NOVELTY - The process comprises activating the vapor from a coating material present in the form of a precursor in an activation zone (5) and guiding the vapor in the direction of a substrate (1), where the activation step is carried out by a plasma produced using hollow cathode glow discharge and a plasma electrode. The plasma forms a plasma zone (3), where a dissipation zone (4) for reducing the energy of the plasma is arranged between the plasma zone and activation zone. The plasma forming plasma zone is formed from free electrons and ions. The stimulation of the discharge is produced by DC voltage. DETAILED DESCRIPTION - The process comprises activating the vapor from a coating material present in the form of a precursor in an activation zone (5) and guiding the vapor in the direction of a substrate (1), where the activation step is carried out by a plasma produced using hollow cathode glow discharge and a plasma electrode. The plasma forms a plasma zone (3), where a dissipation zone (4) for reducing the energy of the plasma is arranged between the plasma zone and the activation zone. The plasma forming plasma zone is formed from free electrons and ions. The stimulation of the discharge is produced by DC voltage, pulsed DC voltage, low-, middle- or high frequency AC voltage or microwaves. The DC voltage or AC voltage of 20-2000 volt is applied to the plasma electrode and the anode. The length of the dissipation zone is selected, so that the energy of the electrons in the activation zone is less than 3 eV with a working pressure dominating in the dissipation zone. The working pressure in the dissipation zone is 0.1-10 mbar. The electrons led out from the plasma are guided inside the activation zone transverse to the direction of the precursor flow and/or the electrons forming the plasma are guided inside the activation zone parallel to the direction of the precursor flow. The electrons are guided in same or opposite direction to the precursor flow. The formation of the plasma-, dissipation- and activation zone takes place in a direction of permanently enlarged area. The formation of the activation zone takes place, so that it represents in the direction of the permanently enlarged area, where the direction is parallel or nearly parallel to the substrate surface. Several plasma zones and activation zones are arranged next to each other in a linear direction or in two flat directions to the simultaneous and uniform coating of larger surfaces. A reactive gas is guided into the activation zone. The introduction of a scavenging gas e.g. argon is provided for avoiding the coating of the surfaces, which limit the plasma. An INDEPENDENT CLAIM is included for a device for coating substrates. USE - Process for coating organic substrates that is made of metal, glass, plastics and ceramics, for the production of barrier coatings, corrosion protection coatings, wear protective coatings and scratch protective coatings made of plastic, for the production of organic layers with defined electrical conductivity and for the production of organic layers with specific spectral absorption (claimed). ADVANTAGE - The process is capable of simply and uniformly coating the substrates with high chemical resistance.

: http://publica.fraunhofer.de/dokumente/N-139541.html