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2003
Conference Paper
Titel
Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Abstract
For optimum design of electronics cooling solutions thermal performance and thermo-mechanical reliability have to be addressed right from the beginning and on an equal footing. This entails a comprehensive approach: Virtual prototyping by FE-simulations as well as experimental verification and testing focused a priori on materials, technology and failure-related issues. In this paper we present an approach based on this principle to design reliable thermal management solutions for high power chip modules. This approach is exemplified for a closed-loop micro-channel water cooling system, where the accent is put on flip-chip reverse side cooling. A numerical parametric study is carried out for an optimisation with respect to thermal performance and thermo-mechanical reliability, where the results concerning lifetime may also be extended to air-cooled systems.