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Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC

 
: Spraul, M.; Nüchter, W.; Möller, A.; Schubert, A.; Michel, B.

Ernst, L.J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems, ESIME 2003. Proceedings : March 30 - April 2, 2003, Centre de Congrès d'Aix, Aix-en-Provence, France
Piscataway, NJ: IEEE, 2003
ISBN: 0-7803-7054-6
International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <4, 2003, Aix-en-Provence>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-139134.html