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a46Parametric FE-approach to flip chip reliability under various loading situations
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2002
Conference Paper
Titel
a46Parametric FE-approach to flip chip reliability under various loading situations
Author(s)
Wunderle, B.
Nüchter, W.
Schubert, A.
Michel, B.
Reichl, H.
Hauptwerk
3rd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, ESIME 2002. Proceedings
Konferenz
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) 2002
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM