Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

3D System-on-Chip technologies for More than Moore systems

: Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.


Microsystem Technologies 16 (2010), Nr.7, S.1051-1055
ISSN: 0946-7076
Fraunhofer IZM ()

3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC) technology is to introduce a post backend-of-line TSV process as an optimized technology for heterogeneous system integration. The introduced ICV-SLID process, that combines both TSVs and bonding, enables 3D integration of fabricated devices. Reliability issues related to thermo-mechanical stress caused by the TSV formation and the bonding are considered. 3D-SOC technology choices made to realize a heterogeneous ultra-small IC stack for a wireless tire pressure monitoring system (TPMS) as an automotive application are described.