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Key components for optical broadband communication based in InP

: Preier, H.; Doldissen, W.; Venghaus, H.

Nachrichtentechnische Zeitschrift : NTZ 45 (1992), Nr.4, S.262-266, 268, 270-271
ISSN: 0027-707X
Fraunhofer HHI ()
iii-v semiconductors; indium compounds; integrated optoelectronics; optical communication equipment; transient elements; loss dispersion matching; semiconductors; optical broadband communication; opto-electronic components; receive elements; opto-electronic integrated circuits; oeic; dispersion minima; InP technology

The authors review the system aspects of broadband communications, and derive the requirements for optical and opto-electronic components. Hardware based on InP and GaAs, occupies a prominent position alongside the glass transmission fibre and silicon, because the transmit and receive elements, as well as many other components, can be manufactured as single units or as opto-electronic integrated circuits (OEIC). InP has the advantage that transmit and receive components can be produced to match the loss and dispersion minima of the fibres, making it particularly suitable for broadband communication. The first part is mainly concerned with InP and the current state of InP technology.